Random indexing is a dimensionality reduction method and computational framework for distributional semantics, based on the insight that very-high-dimensional vector space model implementations are impractical, that models need not grow in dimensionality when new items (e.g. new terminology) are encountered, and that a high-dimensional model can be projected into a space of lower dimensionality without compromising L2 distance metrics if the resulting dimensions are chosen appropriately. This is the original point of the random projection approach to dimension reduction first formulated as the Johnson–Lindenstrauss lemma, and locality-sensitive hashing has some of the same starting points. Random indexing, as used in representation of language, originates from the work of Pentti Kanerva on sparse distributed memory, and can be described as an incremental formulation of a random projection. It can be also verified that random indexing is a random projection technique for the construction of Euclidean spaces—i.e. L2 normed vector spaces. In Euclidean spaces, random projections are elucidated using the Johnson–Lindenstrauss lemma. The TopSig technique extends the random indexing model to produce bit vectors for comparison with the Hamming distance similarity function. It is used for improving the performance of information retrieval and document clustering. In a similar line of research, Random Manhattan Integer Indexing (RMII) is proposed for improving the performance of the methods that employ the Manhattan distance between text units. Many random indexing methods primarily generate similarity from co-occurrence of items in a corpus. Reflexive Random Indexing (RRI) generates similarity from co-occurrence and from shared occurrence with other items.
2024–present global memory supply shortage
A global computer memory supply shortage started in 2024 due to supply constraints and rapid price escalation in the semiconductor memory market, particularly affecting DRAM and NAND flash memory. This shortage is sometimes labelled by tech media outlets as "RAMmageddon" or the "RAMpocalypse". Unlike the 2020–2023 global chip shortage, which stemmed primarily from pandemic-related supply chain disruptions from COVID-19, this shortage is driven by a structural reallocation of manufacturing capacity toward high-margin products for artificial intelligence infrastructure, creating scarcity of computer memory in consumer and enterprise PC markets. According to a 2026 Kearney's PERLab analysis, the shortage is expected to last at least until 2030, with CEOs agreeing with the timelines. == Background == Following a severe market downturn in 2022–2023, major memory manufacturers—Samsung Electronics, SK Hynix, and Micron Technology—implemented strategic production cuts to stabilize pricing. By mid-2024, the rapid expansion of generative AI services triggered unprecedented demand for specialized memory products, particularly High Bandwidth Memory (HBM) used in AI accelerators and data center GPUs. Specialized components of semiconductor technology are also experiencing supply constraints due to high demand in AI application. For example, glass cloth, a high-performance glass fiber substrate used for power efficient high speed data transfer and a crucial component of semiconductor manufacturing, is experiencing a supply crisis. Nitto Boseki, a Japanese firm having overwhelming monopoly in its production, is not able to meet increased demands, making chip-makers such as Qualcomm, Apple, Nvidia and AMD compete for securing supply. There are also reports of smaller electronics companies struggling to find suppliers for components such as NAND flash. Memory suppliers are adapting to increased demands and market unpredictability by requiring prepayment or shorter time-frame of payment, which makes it more difficult for smaller firms to acquire capital to survive. By 2026, due to steadily increased demand on resources, CPUs are also experiencing shortage issues due to low fabrication capacity, prioritisation of server CPUs, and increased demand, with CPU prices also being forecast to increase by as much as 15%. The demand on memory has also increased strain on other electronic components such as hard disk devices, with reports such as Western Digital's hard disk supply for 2026 being booked for enterprise applications before February 2026. A 2024 McKinsey analysis projected that global demand for AI-ready data center capacity would grow at approximately 33% annually through 2030, with AI workloads consuming roughly 70% of total data center capacity by the decade's end. In addition, according to Kearney's State of Semiconductor 2025 Report, executives were already expecting a shortage in the <8nm wafer size with memory chips being mentioned as an acute source of concern. Multiple companies mentioned being prepared for it through long-term agreements with RAM suppliers or amassing additional inventory. On 24 March 2026, Google announced TurboQuant, a memory compression technology focused on large language models (LLM) and vector search engines, which it claimed achieves 6x lower memory consumption in tested local LLMs and 8x performance enhancement in tests running on H100 accelerators. The technology is also a drop in enhancement for existing inference pipeline. Amid speculation about memory demand trends, memory manufacturers, SanDisk, Micron, Western Digital and Seagate, among other companies involved in memory manufacture experienced stock price declines. Prices of memory kits also reduced in the following months, although still at inflated prices. == Causes == === HBM production displacement === HBM manufacturing requires significantly more wafer capacity per bit than standard DRAM modules. Industry sources reported that as manufacturers allocated increasing wafer capacity to HBM production to meet contracts with AI infrastructure providers, the supply of conventional DDR4 and DDR5 modules for consumer PCs and smartphones contracted sharply. By September 2025, Samsung Electronics had reportedly expanded its 1c DRAM capacity to target 60,000 wafers per month specifically for HBM4 production, further diverting resources from consumer memory lines. === Geopolitical and trade barriers === The supply chain was further constrained by escalating trade tensions between the United States and China. Throughout 2025, fears of U.S. regulatory backlash and new tariff structures led major manufacturers like Samsung and SK Hynix to halt sales of older semiconductor manufacturing equipment to Chinese entities, effectively capping production capacity in the region. Additionally, proposed tariff policies by the U.S. administration in late 2025 prompted supply chain realignments, with Apple reportedly accelerating plans to source all U.S.-bound iPhones from India to avoid potential levies. === NAND flash capacity constraints === In the NAND flash segment, manufacturers prioritized higher-margin enterprise SSDs for data center applications while phasing out older process nodes more rapidly than anticipated. In November 2025, contract prices for NAND wafers increased by more than 60% month-over-month for certain product categories, with 512GB TLC experiencing the steepest rise as legacy manufacturing capacity was retired. == Impact on industry and consumers == === Manufacturer responses === Major PC manufacturers responded to component cost increases with significant price adjustments and supply chain strategies. Dell Technologies Chief Operating Officer Jeff Clarke stated during a November 2025 analyst call that the company had "never witnessed costs escalating at the current pace," describing tighter availability across DRAM, hard drives, and NAND flash memory. Analysts at Morgan Stanley downgraded Dell Technologies stock from "Overweight" to "Underweight" in late 2025, citing the company's heavy exposure to rising server memory costs. The firm warned that skyrocketing memory prices could significantly erode margins for server and PC OEMs. Conversely, Apple Inc. was reportedly less affected than its competitors, having secured long-term supply agreements for DRAM through the first quarter of 2026. Lenovo Chief Financial Officer Winston Cheng described the cost surge as "unprecedented" and disclosed that the company's memory inventories were approximately 50% above normal levels in anticipation of further price increases. === Consumer electronics sector === The shortage particularly affected smartphone manufacturers and other consumer electronics producers. DRAM prices reportedly rose by 172% throughout 2025, leading manufacturers like Samsung to halt new orders for DDR5 modules to reassess pricing structures and Micron to exit its 'Crucial' brand of consumer products. In Tokyo's Akihabara electronics district, retailers began limiting purchases of memory products to prevent hoarding, with prices for popular DDR5 memory modules more than doubling in some cases. Despite the broad trend of rising hardware costs, some companies engaged in aggressive pricing strategies to maintain market share; for example, Sony reduced the price of the PlayStation 5 by $100 for Black Friday 2025, potentially absorbing increased component costs to stimulate software ecosystem growth. Due to memory prices more than doubling in a single quarter, HP revealed in its Q1 2026 earnings call that memory costs account for 35% of PC build materials up from 15-18% previous quarter. Despite showing strong Q1 2026 earning driven by Windows 11 upgrade cycle and AI PC adoption, HP warned investors of low operating margins and up to double digit percentage decline for coming quarter. Trendforce, an IT analytics company, updated its forecast from 1.7% year-over-year growth in PC market to 2.6% year-over-year decline for 2026, amid backdrop of steadily increasing prices and supply crisis. Research and analytics firms, Gartner and IDC expect worldwide PC market to decline 10-11% and smartphone market to decline 8-9% in 2026. Gartner also projects that rising memory prices will make low-margin entry level laptops under 500 USD financially unviable in two years. The RAM shortage has delayed the release of Valve's second Steam Machine due to increased memory prices. The device was originally set to launch in early 2026. === AI infrastructure competition === Technology companies including Google, Amazon, Microsoft, and Meta Platforms placed open-ended orders with memory suppliers, indicating they would accept as much supply as available regardless of cost, according to Reuters sources. The limited supply of AI chips has been cited as a reason for the slow down in compute growth. In October 2025, OpenAI formally announced a strategic partnership using letters of intent with Samsung Electronics and SK Hynix
Viaweb
Viaweb was a web-based application that allowed users to build and host their own online stores with little technical expertise using a web browser. The company was started in July 1995 by Paul Graham, Robert Morris (using the pseudonym "John McArtyem"), and Trevor Blackwell. Graham claims Viaweb was the first application service provider. Viaweb was also unusual for being partially written in the Lisp programming language. The software was originally called Webgen, but another company was using the same name, so the company renamed it to Viaweb, "because it worked via the Web". In 1998, Yahoo! Inc. bought Viaweb for 455,000 shares of Yahoo! capital stock, valued at about $49 million, and renamed it Yahoo! Store. Viaweb's example has been influential in Silicon Valley's entrepreneurial culture, largely due to Graham's widely read essays and his subsequent career as a successful venture capitalist.
Color image pipeline
An image pipeline or video pipeline is the set of components commonly used between an image source (such as a camera, a scanner, or the rendering engine in a computer game), and an image renderer (such as a television set, a computer screen, a computer printer or cinema screen), or for performing any intermediate digital image processing consisting of two or more separate processing blocks. An image/video pipeline may be implemented as computer software, in a digital signal processor, on an FPGA, or as fixed-function ASIC. In addition, analog circuits can be used to do many of the same functions. Typical components include image sensor corrections (including debayering or applying a Bayer filter), noise reduction, image scaling, gamma correction, image enhancement, colorspace conversion (between formats such as RGB, YUV or YCbCr), chroma subsampling, framerate conversion, image compression/video compression (such as JPEG), and computer data storage/data transmission. Typical goals of an imaging pipeline may be perceptually pleasing end-results, colorimetric precision, a high degree of flexibility, low cost/low CPU utilization/long battery life, or reduction in bandwidth/file size. Some functions may be algorithmically linear. Mathematically, those elements can be connected in any order without changing the end-result. As digital computers use a finite approximation to numerical computing, this is in practice not true. Other elements may be non-linear or time-variant. For both cases, there is often one or a few sequences of components that makes sense for optimum precision and minimum hardware-cost/CPU-load.
The Cancer Imaging Archive
The Cancer Imaging Archive (TCIA) is an open-access database of medical images for cancer research. The site is funded by the National Cancer Institute's (NCI) Cancer Imaging Program, and the contract is operated by the University of Arkansas for Medical Sciences. Data within the archive is organized into collections which typically share a common cancer type and/or anatomical site. The majority of the data consists of CT, MRI, and nuclear medicine (e.g. PET) images stored in DICOM format, but many other types of supporting data are also provided or linked to, in order to enhance research utility. All data are de-identified in order to comply with the Health Insurance Portability and Accountability Act and National Institutes of Health data sharing policies. TCIA resources are intended to support: Development of computer aided diagnosis methods (quantitative imaging) Evaluation of unbiased science reproducibility by acceptable standard statistical methods Research on correlation of clinical diagnostic medical images with digital microscopic histological images Exploratory biomarker research for which imaging is a key element Collaboration between cross-disciplinary investigators where imaging is crucial to research on tumor heterogeneity, between patients and within the tumor; tissue temporal response tracking - objective measurements of tumor progression; imaging genomics and Big Data linkages and analysis (clinical, histo-pathology, genomics) TCIA is recognized as a recommended repository for the Scientific Data, PLOS One, and F1000Research journals. It is also listed in the Registry of Research Data Repositories. == History == Prior to the creation of TCIA, the NCI funded development of the National Biomedical Imaging Archive. NBIA is an open-source Web application which was designed to allow the storage and query of DICOM images. TCIA was subsequently initiated in December 2010 to expand data sharing activities by funding a service component which would help address the technical and policy challenges associated with medical imaging research. TCIA leverages open-source tools such as NBIA and Clinical Trials Processor in order to provide its services. == Organization of the archive == The site content is organized into five categories: About Us - Provides a general overview of the site the organizations responsible for operating it. Share Your Data - Provides an overview of how to apply to upload data to the archive. Access the Archive - Provides information about the available data, methods for accessing that data and system usage metrics. Research Activities - Provides information about major research initiatives being conducted using TCIA data as well as information about publication guidelines. Help - Provides information about how to get support using the archive as well as documentation and data usage policies. == Methods for accessing data == Most collections on the Cancer Imaging Archive can be accessed without an account, but a few are restricted to specific users and therefore require an account to access them. TCIA has several ways to browse, filter, and download data. They include: Downloading the entire contents of a collection in bulk Leveraging the NBIA application to filter or search within or across collections Utilizing the RESTful Application programming interface to filter or search within or across collections === Browsing, bulk downloading and access to supporting data === The home page includes a list of all available collections. Basic information about the data such as the cancer type, cancer location, modalities, and number of subjects are also provided. Clicking on a collection name presents a page which describes the data including its original research purpose, how the data were generated, and how it might be useful to other TCIA users. For example, doi:10.7937/K9/TCIA.2015.L4FRET6Z describes the NSCLC-Radiomics-Genomics Collection. In the lower section of the page there are links to search or download the images and any available supporting data in the Data Access tab. Additional tabs provide information about data versions and how to cite the data if used in publications. Many collections contain additional data types such as genomics, patient demographics, treatment details, and expert analyses of the images. This data is usually only found by browsing the collection pages as opposed to searching in NBIA or using the API. === Filtering or searching with NBIA === On each Collection page and also in the main menu of the site there are links to "Search TCIA". This will load the NBIA application which allows simple, advanced and free text searches. Search results follow the conventional DICOM hierarchy of patient -> study -> series. TCIA provides comprehensive documentation on the various features of the NBIA software. === RESTful API === A number of search and download commands are also available through the API. New iterations on the API are released as new versions, so that existing applications developed against older versions of the API continue to function. == Research activities == A list of known publications based on TCIA data is maintained as a convenience to researchers who might want to investigate how it has been used previously. In addition to peer-reviewed publications there are also several major research initiatives described in the Research Activities section of the site. === The CIP TCGA Radiology Initiative for Radiogenomics Research === A large number of collections contain subjects which were analyzed as part of the NIH/NHGRI database known as The Cancer Genome Atlas (TCGA). This offers researchers the ability to correlate clinical images using shared unique identifiers each study that has in TCGA extensive genomic analysis, digital pathology slides and bulk download of individual demographic data and clinical data. A multi-institutional network of investigators volunteering their time is using the data to develop methods to determine prognosis or predict the response to therapy. TCGA collections are designated by nomenclature shared by the TCGA Data Portal (e.g.: TCGA-BRCA, TCGA-GBM, etc). They are subject to a special publication policy which is unique from the other public data on TCIA. === Challenge competitions === TCIA also provides specific data sets used for "Challenge" competitions such as international digital image-focused professional societies like MICCAI, SPIE, or ISBI. A directory of previous and upcoming challenges is maintained on the site. === Digital object identifiers === To facilitate data sharing, many publications encourage authors to include data citations to the data that the authors used in creating the results described in their scholarly papers. In addition, new journals are now available for describing data collections outright (e.g., Nature Scientific Data). TCIA assigns digital object identifiers (DOIs) to all collections when they are submitted, and also has the ability to create persistent identifiers linked to subsets of data held within TCIA that authors may use for data citations in their scholarly papers.
Foveated rendering
Foveated rendering is a rendering technique which uses an eye tracker integrated with a virtual reality headset to reduce the rendering workload by greatly reducing the image quality in the peripheral vision (outside of the zone gazed by the fovea). A less sophisticated variant called fixed foveated rendering doesn't utilise eye tracking and instead assumes a fixed focal point. == History == Research into foveated rendering dates back at least to 1991. At Tech Crunch Disrupt SF 2014, Fove unveiled a headset featuring foveated rendering. This was followed by a successful kickstarter in May 2015. At CES 2016, SensoMotoric Instruments (SMI) demoed a new 250 Hz eye tracking system and a working foveated rendering solution. It resulted from a partnership with camera sensor manufacturer Omnivision who provided the camera hardware for the new system. In July 2016, Nvidia demonstrated during SIGGRAPH a new method of foveated rendering claimed to be invisible to users. In February 2017, Qualcomm announced their Snapdragon 835 Virtual Reality Development Kit (VRDK) which includes foveated rendering support called Adreno Foveation. == Use == According to chief scientist Michael Abrash at Oculus, utilising foveated rendering in conjunction with sparse rendering and deep learning image reconstruction has the potential to require an order of magnitude fewer pixels to be rendered in comparison to a full image. Later, these results have been demonstrated and published. In December 2019, fixed foveated rendering support was added to the Oculus Quest SDK. A number of VR headsets have included on-board eye tracking to provide support for foveated rendering, including HTC's Vive Pro Eye (2019), Meta Quest Pro (2022), PlayStation VR2 (2023), and Apple Vision Pro (2024). In 2025, Valve announced the upcoming Steam Frame headset, which applies a variation of the technique known as "foveated streaming" for wireless streaming from a PC to the headset; the method similarly uses variance in bit rate, and is performed at the encoder level rather than the software level.
Apache CarbonData
Apache CarbonData is a free and open-source column-oriented data storage format of the Apache Hadoop ecosystem. It is similar to the other columnar-storage file formats available in Hadoop namely RCFile and ORC. It is compatible with most of the data processing frameworks in the Hadoop environment. It provides efficient data compression and encoding schemes with enhanced performance to handle complex data in bulk. == History == CarbonData was developed at Huawei in 2013. The project was donated to the Apache Community in 2015 submitted to the Apache Incubator in June 2016. The project won top honors in the BlackDuck 2016 Open Source Rookies of the Year's Big Data category. Apache CarbonData has been a top-level Apache Software Foundation (ASF)-sponsored project since May 1, 2017.