AirPair is a service and eponymous company that connects people who need help with programming issues (usually, programmers at small technology companies or at finance companies that use technology products) and people who can help them. Unlike services such as oDesk and Elance, AirPair is not a service for outsourcing programming tasks, but rather a service that facilitates one-off knowledge transfers from people with highly specialized knowledge of particular technology stacks or programming issues to people who are in need of specialized help. == History == AirPair launched in March 2013, with founder Jonathon Kresner, who hails from Australia, working full-time, and it soon hired three other part-time developers to work alongside him. Kresner had previously founded two other startups: Preparty, a social invitation and event-booking service based in Australia, and ClimbFind, an online rock-climbing community that reached a million users. Kresner was inspired to work on AirPair because he saw the need for outside expert assistance with programming issues arise regularly at these startups. In November 2013, founder Kresner describes the company's initial success at bootstrapping itself to "Ramen profitability" in a blog post. In December 2013, AirPair was accepted into the Winter 2014 Y Combinator batch. In March 2014, AirPair announced it would launch partnerships with Stripe, Twilio, and other companies that had their own application programming interfaces, allowing developers having trouble with the APIs to seek help over AirPair from experts on the APIs. AirPair presented at the Y Combinator Winter 2014 Demo Day on March 25, 2014, and successfully raised over $1 million within the next 48 hours. == Reception == A review of AirPair by Will Lam stressed that because payment was based on time rather than results, it was important to use it for clearly thought-out questions where one had high confidence that the session would help. Dennis Beatty, who met AirPair founder Jonathon Kresner in March 2014, wrote in April 2014 a glowing review of AirPair's vision of connecting people and its business success. AirPair has been compared with other peer-to-peer coding help sites such as Codementor and HackHands.
Deep Learning Anti-Aliasing
Deep Learning Anti-Aliasing (DLAA) is a form of spatial anti-aliasing developed by Nvidia. DLAA depends on and requires Tensor Cores available in Nvidia RTX cards. DLAA is similar to Deep Learning Super Sampling (DLSS) in its anti-aliasing method, with one important differentiation being that the goal of DLSS is to increase performance at the cost of image quality, whereas the main priority of DLAA is improving image quality at the cost of performance (irrelevant of resolution upscaling or downscaling). DLAA is similar to temporal anti-aliasing (TAA) in that they are both spatial anti-aliasing solutions relying on past frame data. Compared to TAA, DLAA is substantially better when it comes to shimmering, flickering, and handling small meshes like wires. == Technical overview == DLAA collects game rendering data including raw low-resolution input, motion vectors, depth buffers, and exposure information. This information feeds into a convolutional neural network that processes the image to reduce aliasing while preserving fine detail. The neural network architecture employs an auto-encoder design trained on high-quality reference images. The training dataset includes diverse scenarios focusing on challenging cases like sub-pixel details, high-contrast edges, and transparent surfaces. The network then processes frames in real-time. Unlike traditional anti-aliasing solutions that rely on manually written heuristics, such as TAA, DLAA uses its neural network to preserve fine details while eliminating unwanted visual artifacts. == History == DLAA was initially called and marketed by Nvidia as DLSS 2x. The first game that added support for DLAA was The Elder Scrolls Online, which implemented the feature in 2021. By June 2022, DLAA was only available in six games. This number rose to 17 by February 2023. In June 2023, TechPowerUp reported that "DLAA is seeing sluggish adoption among game developers", and that Nvidia was working on adding DLAA to the quality presets of DLSS to boost adoption. By December 2023, DLAA was supported in 41 games. In early 2025, an update for the Nvidia App added a driver-based DLSS override feature that enables users to activate DLAA even in games that do not support it natively. == Differences between TAA and DLAA == TAA is used in many modern video games and game engines; however, all previous implementations have used some form of manually written heuristics to prevent temporal artifacts such as ghosting and flickering. One example of this is neighborhood clamping which forcefully prevents samples collected in previous frames from deviating too much compared to nearby pixels in newer frames. This helps to identify and fix many temporal artifacts, but deliberately removing fine details in this way is analogous to applying a blur filter, and thus the final image can appear blurry when using this method. DLAA uses an auto-encoder convolutional neural network trained to identify and fix temporal artifacts, instead of manually programmed heuristics as mentioned above. Because of this, DLAA can generally resolve detail better than other TAA and TAAU implementations, while also removing most temporal artifacts. == Differences between DLSS and DLAA == While DLSS handles upscaling with a focus on performance, DLAA handles anti-aliasing with a focus on visual quality. DLAA runs at the given screen resolution with no upscaling or downscaling functionality provided by DLAA. DLSS and DLAA share the same AI-driven anti-aliasing method. As such, DLAA functions like DLSS without the upscaling part. Both are made by Nvidia and require Tensor Cores. However, DLSS and DLAA cannot be enabled at the same time, only one can be selected depending on whether performance or image quality is prioritized. == Reception == TechPowerUp found that "[c]ompared to TAA and DLSS, DLAA is clearly producing the best image quality, especially at lower resolutions", arguing that, while "DLSS was already doing a better job than TAA at reconstructing small objects", "DLAA does an even better job". In a Cyberpunk 2077 performance test, IGN stated that "DLAA provided somewhat similar results [FPS wise] to the normal raster mode in most cases but got significant performance boost with the help of frame generation", a feature not available when using native resolution. Rock Paper Shotgun noted that, while DLAA is "not a completely perfect form of anti-aliasing, as the occasional jaggies are present", it "looks a lot sharper overall [than TAA], and especially in motion." According to PC World, "DLAA offers very good anti-aliasing without losing visual information — alternatives like TAA tend to struggle during motion-filled scenes, where DLAA doesn’t. Furthermore, DLAA’s loss of performance is lower than with conventional anti-aliasing methods."
MicroTCA
MicroTCA (short for Micro Telecommunications Computing Architecture, also: μTCA) is a modular, open standard, created and maintained by the PCI Industrial Computer Manufacturers Group (PICMG). It provides the electrical, mechanical, thermal and management specifications to create a switched fabric computer system, using Advanced Mezzanine Cards (AMC), connected directly to a backplane. MicroTCA is a descendant of the AdvancedTCA standard. == History == The rapid expansion of mobile telecommunications and their associated services (such as text messages) at the beginning of the millennium increased the demand of processing power in telecommunication systems. The existing "carrier grade" (see RAS) computing architectures were not fit to house the high performance processors of the time. In order to answer those demands, about 100 companies worked together in PICMG, resulting in the Advanced Telecommunications Architecture (AdvancedTCA, ATCA), published in 2002. After the introduction of AdvancedTCA, a standard was developed, to cater towards smaller telecommunications systems at the edge of the network. This standard was geared towards a more compact, less expensive systems, without cutting back on reliability or data throughput. This standard, called MicroTCA, was ratified 2006. MicroTCA systems migrated after its release into non-telecommunication sectors, like defence, avionics and science. This resulted in extensions to the base-standard, called modules. == Modules == === MicroTCA.0 === The base-specification for properties common to all other modules, ratified July 6, 2006. This includes: Mechanical specifications, like possible dimensions of card cages, backplanes and supported AMC-modules Electrical specifications, like power distribution and interface layout Thermal specifications, like possible cooling layouts or available cooling power Management specifications A second revision of the base-specifications was ratified January 16, 2020, containing some corrections, as well as alterations, necessary to implement higher speed Ethernet fabrics, like 10GBASE-KR and 40GBASE-KR4. === MicroTCA.1 === This module adds specifications for ruggedized systems, using forced air for cooling. Possible scenarios for MicroTCA.1-based systems include outside plant telecom, industrial and aerospace environments === MicroTCA.2 === This module adds specifications for more stringent requirements with regards to temperature, shock, vibration and other environmental conditions. These specifications are geared towards use in outside plant telecom, machine and transport industry, as well as military airborne, shipboard and ground mobile equipment. MicroTCA.2 allows the use of air- and conduction-cooled AMC-modules. === MicroTCA.3 === This module adds specifications for even more stringent requirements with regards to temperature, shock, vibration and other environmental conditions. These specifications are geared towards use in outside plant telecom, machine and transport industry, as well as military airborne, shipboard and ground mobile equipment. MicroTCA.3 requires the use of conduction-cooled AMC-modules. === MicroTCA.4 === This module extends the AMC with a Rear Transition Module (RTM), increasing PCB-space and modularity. AMC and RTM are connected with a connector, located in zone 3, defined in MicroTCA.0. These specifications are geared towards use in large-scale scientific devices, like particle accelerators or telescopes. == Components of MicroTCA == === Card Cage === The card cage (also: shelf, crate) houses all the other components and as such has two primary functions: Provide mechanical stability to the other components Ensure sufficient cooling There exist a wide array of card cages. They usually differ in: the type of modules they support (MTCA.0, MTCA.1, ...) the number of slots they provide (typically between 2 and 12) the architecture of the installed backplane (see below) the cooling scheme they use (i.e. airflow front-to-back, bottom-to-top, side-to-side, conductive,...) === Backplane === The backplane is a printed circuit board, mounted directly into the card cage. It connects all other components of a MicroTCA system to each other and provides power, data access and management access to them. Two types of power are distributed over the backplane, Management Power (+3.3 V) and Payload Power (+12 V). Unlike typical backplanes, where power is distributed to all components via a common "powerplane" in the PCB, on a MicroTCA backplane, Management and Payload Power are distributed to each component individually. While Management Power is provided to each module connected to a powered backplane, Payload Power has to be granted by the MicroTCA Carrier Hub (MCH), after ensuring that the module is MicroTCA-compatible. The standard defines various communication buses, which the backplane can/should provide: Gigabit Ethernet IPMI SATA Fat pipe (can be used for PCIe, SRIO or 10G/40G Ethernet) Point to Point Links Clocks JTAG === Cooling Unit === The Cooling Unit (CU) provides controlled air flow in air-flow-cooled card cages. It usually consists of an array of fans and a controller, which is connected to the backplane. The MicroTCA Carrier Hub (MCH) can read-out temperature sensors (if present) and fan speed, as well as change fan speed via IPMI. The Cooling Unit is usually fitted to a specific card cage. Some CUs are easily detachable (i.e. for cleaning or replacement), while other card cages come with integrated, non-detachable CUs. === Power Module === The Power Module (PM, also: Power Supply) converts the AC power from the power line to the +3.3 V Management Power (MP) and +12 V Payload Power (PP), both of which are DC. There exist a variety of power modules, which differ in: form factor (i.e. double width, single width) input voltage (110 V, 220 V, both) output power (i.e. 600 W, 1000 W) The power module senses the presence of a module in a slot via a specified pin in the module connector, and immediately provides that module with management power. Payload power is managed by the MicroTCA Carrier Hub (MCH), which communicates with the power module via IPMI. The power module uses its own type of connector, and can thus only be installed into designated slots, which in turn can't carry any other type of module. Some card cages provide an additional power module slot for redundancy. In such a case, one slot is the primary, which will provide power by default, and the other one is secondary, providing power only, if the primary does not. === MicroTCA Carrier Hub === The MicroTCA Carrier Hub (MCH) is the central managing device of a MicroTCA card cage. It manages power distribution and cooling. It usually also provides Gigabit Ethernet and/or PCIe/Serial RapidIO switching. Some MCHs additionally provide clocking. As the name indicates, they are the hub of various star topologies (i.e. for Ethernet, PCIe) on the backplane and thus require dedicated slot(s). Some backplanes support two MCHs for redundancy. In this case there are two MCH slots, with one being designated primary, and one secondary. === Advanced Mezzanine Card === Advanced Mezzanine Card (AMC) is a standard for hot-pluggable PCBs. It was originally developed to be used in AdvancedTCA systems. The standard specifies: the dimensions of the PCB with two width variants (single, double) and three height variants (Compact, Mid-size, Full) type, location and orientation of connectors (i.e. Zone 1, 2, 3) There is a huge variation of functionalities, an AMC can fulfill: Computing (i.e. a module with CPU, RAM, SSD and on-board graphics) Storage (i.e. SSD carrier) Graphics card FPGA card (i.e. for signal processing) FMC carrier Digitizer card (Analog-Digital and Digital-Analog Conversion) Clocking and Triggering and others === Rear Transition Module (MTCA.4 only) === The Rear Transition Module (RTM) was added in the MicroTCA.4 standard. It is connected directly to an AMC via a connector, located in zone 3, requiring a double width AMC and RTM. An RTM has about the same dimensions, as an AMC, basically doubling the available PCB-space per slot in an MTCA.4 card cage. Its power is provided by the AMC. Thus an RTM can not operate on its own, but requires a paired AMC. The zone 3 connector is electrically free configurable, making it possible, that a mechanically fitting AMC-RTM pair is electrically incompatible. To avoid damage due to that incompatibility, a mechanical code-pin was added to MTCA.4-compatible AMCs and RTMs, mechanically preventing the installation of an electrically incompatible RTM to an AMC. The functionality of RTMs includes, but is not limited to: RF-signal pre-/post-processing (i.e. filtering, Up-/Down-conversion, Vector De-/Modulation) Digital signal pre-/post-processing Clock-generation/-distribution Device interfaces Date storage CPU (only MCH-RTM)
Honeywell JetWave
Honeywell's JetWave is a piece of satellite communications hardware produced by Honeywell that enables global in-flight internet connectivity. Its connectivity is provided using Inmarsat’s GX Aviation network. The JetWave platform is used in business and general aviation, as well as defense and commercial airline users. == History == In 2012, Honeywell announced it would provide Inmarsat with the hardware for its GX Ka-band in-flight connectivity network. The Ka-band (pronounced either "kay-ay band" or "ka band") is a portion of the microwave part of the electromagnetic spectrum defined as frequencies in the range 27.5 to 31 gigahertz (GHz). In satellite communications, the Ka-band allows higher bandwidth communication. In 2017, after five years and more than 180 flight hours and testing, JetWave was launched as part of GX Aviation with Lufthansa Group. Honeywell’s JetWave was the exclusive terminal hardware option for the Inmarsat GX Aviation network; however, the exclusivity clause in that contract has expired. In July 2019, the United States Air Force selected Honeywell’s JetWave satcom system for 70 of its C-17 Globemaster III cargo planes. In December 2019, it was reported that six AirAsia aircraft had been fitted with Inmarsat’s GX Aviation Ka-band connectivity system and is slated to be implemented fleetwide across AirAsia’s Airbus A320 and A330 models in 2020, requiring installation of JetWave atop AirAsia’s fuselages. Today, Honeywell’s JetWave hardware is installed on over 1,000 aircraft worldwide. In August 2021, the Civil Aviation Administration of China approved a validation of Honeywell’s MCS-8420 JetWave satellite connectivity system for Airbus 320 aircraft. In December 2021, Honeywell, SES, and Hughes Network Systems demonstrated multi-orbit high-speed airborne connectivity for military customers using Honeywell’s JetWave MCX terminal with a Hughes HM-series modem, and SES satellites in both medium Earth orbit (MEO) and geostationary orbit (GEO). The tests achieved full duplex data rates of more than 40 megabits per second via a number of SES' (GEO) satellites including GovSat-1, and the high-throughput, low-latency O3b MEO satellite constellation, with connections moving between GEO/MEO links in under 30 sec. == Uses == === Commercial aviation === Honeywell’s JetWave enables air transport and regional aircraft to connect to Inmarsat’s GX Aviation network. The multichannel satellite (MSC) JetWave terminals share the same antenna controller, modem and router hardware with the business market, but have an MCS-8200 fuselage-mounted antenna. === Business aviation === Honeywell’s JetWave hardware allows users to connect to Inmarsat’s Jet ConneX, a business aviation broadband connectivity offering to provide Wi-Fi for connected devices. JetWave offers a tail-mount antenna for business jets. === Defense === Honeywell’s JetWave satellite communications system for defense allows users to connect to the Inmarsat GX network, offering global coverage for military airborne operators, including over water, over nontraditional flight paths and in remote areas. JetWave and the Inmarsat GX network enable mission-critical applications like real-time weather; videoconferencing; large file transfers; encryption capabilities; in-flight briefings; intelligence, surveillance, and reconnaissance video; and secure communications. JetWave is configurable for a variety of military platforms and offers antennas for large and small airframes.
Vacuum tube characteristics
Vacuum tube characteristics (also called tube curves, valve characteristics or valve curves) describes the electrical relationships between electrode voltages and currents in a vacuum tube. These relationships are commonly presented as characteristic curves in tube manuals and engineering references. The curves typically show plate current versus plate voltage for several fixed control-grid voltages, showing how current varies with electrode potentials under controlled conditions. Designers use them to select operating points, determine voltage gain, estimate output power, and construct graphical load-line analyses. The use of characteristic curves as an engineering tool for analyzing vacuum-tube operation was established in the 1910s, notably in work by Edwin Howard Armstrong. Examples of such curves appear in early tube manuals and textbooks and form the basis of classical vacuum-tube circuit design. Different types of vacuum tubes are characterized using plots appropriate to their electrode structure and intended use. Two-electrode devices such as diodes are described primarily by the relation between plate voltage and plate current. Amplifying tubes containing control grids, such as triodes, tetrodes, pentodes, and beam tetrodes, are represented by families of curves measured for different grid voltages. From these families additional parameters such as amplification factor (μ), transconductance (gm), and plate resistance (rp) may be obtained. Although these plots are used primarily for circuit design, their shapes arise from the underlying physics of electron flow in vacuum tubes. The physical principles responsible for the observed characteristics are discussed in later sections. == 3/2 power law == In high-vacuum thermionic diodes operating under normal conditions, plate current increases nonlinearly with plate voltage. Over the space-charge-limited region, the current is well approximated by the three-halves power relation I p = P ⋅ V p 3 / 2 {\displaystyle I_{p}=P\cdot V_{p}^{3/2}} where P {\displaystyle P} is the perveance of the tube. Perveance is determined primarily by electrode geometry, including cathode area and cathode-to-plate spacing. It provides a practical measure of current-producing capability and is often used in tube manuals in place of a complete family of plate-characteristic curves. == Signal diode characterization == For small-signal diodes, tube manuals typically publish a single static anode characteristic showing anode current (Ia) as a function of anode voltage (Va), measured with the heater operating at its rated voltage. Because the diode contains no control grid, only one such I–V curve is required. The low-voltage portion of the curve is particularly important in detector service, where the nonlinear curvature of the current–voltage relation allows a small alternating signal to produce a net direct-current output, resulting in rectification. In addition to the static characteristic, tube manuals specify heater ratings, maximum plate voltage, permissible average current, and interelectrode capacitance. These parameters define the allowable operating region and high-frequency behavior. Another typical data sheet for a diode is for the Philips EB91 double diode. This book includes curves of the diode response in use as a detector. The output voltage is non-zero for an input voltage of 0 due to the Edison effect. == Rectifier characterization == Vacuum-tube rectifiers intended for power-supply service are specified differently from signal diodes. Their data emphasize heater requirements, peak inverse voltage, maximum peak plate current, permissible DC output current for various filter configurations, and regulation characteristics. Rectifier tubes exhibit nonlinear voltage drop that increases with current. For limited operating ranges this behavior may be represented by an equivalent or effective series resistance corresponding to the local slope of the plate characteristic (dynamic plate resistance, dV/dI). Diode voltages can be determied by use of a graphical aide. In capacitor-input supplies, conduction occurs in pulses near the peaks of the AC waveform, producing peak currents substantially greater than the average DC load current. Data sheets therefore specify maximum peak plate current and permissible filter capacitance in addition to average DC ratings. Under varying load conditions, the supply voltage changes in accordance with the rectifier's nonlinear characteristic and effective impedance. == Triode characterization == === Early use === The systematic use of characteristic curves to explain and quantify vacuum-tube amplification was introduced by Edwin Howard Armstrong in 1914. Using measured plate voltage-current curves, Armstrong demonstrated the mechanism of triode amplification and clarified the operation of grid-leak detection. ==== Plate and transfer characteristics ==== Triode data sheets present families of plate characteristics showing plate current I p {\displaystyle I_{p}} as a function of plate voltage E p {\displaystyle E_{p}} for several fixed grid voltages E g {\displaystyle E_{g}} . From these curves the operating point, voltage gain, and load-line behavior may be determined graphically. In normal operation, plate current depends on both grid and plate voltage. Classical analysis shows that the characteristics for different grid voltages are similar in form and differ primarily by horizontal displacement. In triodes, plate current may be approximated by I p = k ( E g + E p μ ) 3 / 2 {\displaystyle I_{p}=k\left(E_{g}+{\frac {E_{p}}{\mu }}\right)^{3/2}} where E g {\displaystyle E_{g}} is the grid voltage, E p {\displaystyle E_{p}} the plate voltage, μ {\displaystyle \mu } the amplification factor, and k {\displaystyle k} a constant determined by the tube geometry.. The amplification factor μ represents the relative effectiveness of grid voltage compared with plate voltage in controlling current. It is fundamentally determined by structural dimensions, particularly grid-to-cathode spacing relative to plate-to-cathode spacing. ==== Small-signal parameters ==== Triodes are commonly characterized by three interrelated small-signal parameters: Amplification factor ( μ {\displaystyle \mu } ) — the change in plate voltage divided by the change in grid voltage at constant plate current: μ = ( ∂ E p ∂ E g ) I p {\displaystyle \mu =\left({\frac {\partial E_{p}}{\partial E_{g}}}\right)_{I_{p}}} Transconductance ( g m {\displaystyle g_{m}} ) — the change in plate current divided by the change in grid voltage at constant plate voltage: g m = ( ∂ I p ∂ E g ) E p {\displaystyle g_{m}=\left({\frac {\partial I_{p}}{\partial E_{g}}}\right)_{E_{p}}} Plate resistance ( r p {\displaystyle r_{p}} ) — the change in plate voltage divided by the change in plate current at constant grid voltage: r p = ( ∂ E p ∂ I p ) E g {\displaystyle r_{p}=\left({\frac {\partial E_{p}}{\partial I_{p}}}\right)_{E_{g}}} These parameters are related by μ = g m r p {\displaystyle \mu =g_{m}r_{p}} as shown in classical tube theory treatments. These parameters are obtained either from slopes of the characteristic curves or from tabulated operating-point data. ==== Comparison of ECC81, ECC82, and ECC83 ==== The ECC81, ECC82, and ECC83 (also known respectively as 12AT7, 12AU7, and 12AX7) are closely related dual triodes widely used in small-signal amplifier stages. Although similar in construction and envelope size, they differ significantly in electrical parameters due to differences in electrode spacing and grid structure. (Data representative of manufacturer specifications.) The ECC83 exhibits high μ {\displaystyle \mu } and high plate resistance, producing large voltage gain but relatively low current drive capability. The ECC82 has lower μ {\displaystyle \mu } and lower plate resistance, allowing greater current delivery and reduced voltage gain. The ECC81 occupies an intermediate position with comparatively high transconductance and moderate amplification factor. These differences arise primarily from variations in grid pitch, cathode area, and electrode spacing, which determine perveance and amplification factor. Although the external envelope is similar, the internal geometry governs the characteristic curves and small-signal parameters. == Tetrode (screen-grid) characterization == The screen-grid tube (tetrode) was developed primarily to reduce the electrostatic coupling between plate and control grid that limited gain and stability in radio-frequency triode amplifiers. In triodes, the grid–plate capacitance provides feedback from plate to grid, restricting obtainable gain and often requiring neutralization circuits such as those used in neutrodyne receivers. By inserting a positively biased screen grid between control grid and plate, this capacitive coupling is greatly reduced, permitting higher stable gain at radio frequencies. The screen grid, also known as the shield grid or grid 2 (to distinguish it from t
Reflection (computer graphics)
Reflection in computer graphics is used to render reflective objects like mirrors and shiny surfaces. Accurate reflections are commonly computed using ray tracing whereas approximate reflections can usually be computed faster by using simpler methods such as environment mapping. Reflections on shiny surfaces like wood or tile can add to the photorealistic effects of a 3D rendering. == Approaches to reflection rendering == For rendering environment reflections there exist many techniques that differ in precision, computational and implementation complexity. Combination of these techniques are also possible. Image order rendering algorithms based on tracing rays of light, such as ray tracing or path tracing, typically compute accurate reflections on general surfaces, including multiple reflections and self reflections. However these algorithms are generally still too computationally expensive for real time rendering (even though specialized HW exists, such as Nvidia RTX) and require a different rendering approach from typically used rasterization. Reflections on planar surfaces, such as planar mirrors or water surfaces, can be computed simply and accurately in real time with two pass rendering — one for the viewer, one for the view in the mirror, usually with the help of stencil buffer. Some older video games used a trick to achieve this effect with one pass rendering by putting the whole mirrored scene behind a transparent plane representing the mirror. Reflections on non-planar (curved) surfaces are more challenging for real time rendering. Main approaches that are used include: Environment mapping (e.g. cube mapping): a technique that has been widely used e.g. in video games, offering reflection approximation that's mostly sufficient to the eye, but lacking self-reflections and requiring pre-rendering of the environment map. The precision can be increased by using a spatial array of environment maps instead of just one. It is also possible to generate cube map reflections in real time, at the cost of memory and computational requirements. Screen space reflections (SSR): a more expensive technique that traces rays come from pixel data.This requires the data of surface normal and either depth buffer (local space) or position buffer (world space).The disadvantage is that objects not captured in the rendered frame cannot appear in the reflections, which results in unresolved and or false intersections causing artefacts such as reflection vanishment and virtual image. SSR was originally introduced as Real Time Local Reflections in CryENGINE 3. == Types of reflection == Polished - A polished reflection is an undisturbed reflection, like a mirror or chrome surface. Blurry - A blurry reflection means that tiny random bumps, or microfacets, on the surface of the material causes the reflection to be blurry. Metallic - A reflection is metallic if the highlights and reflections retain the color of the reflective object. Glossy - This term can be misused: sometimes, it is a setting which is the opposite of blurry (e.g. when "glossiness" has a low value, the reflection is blurry). Sometimes the term is used as a synonym for "blurred reflection". Glossy used in this context means that the reflection is actually blurred. === Polished or mirror reflection === Mirrors are usually almost 100% reflective. === Metallic reflection === Normal (nonmetallic) objects reflect light and colors in the original color of the object being reflected. Metallic objects reflect lights and colors altered by the color of the metallic object itself. === Blurry reflection === Many materials are imperfect reflectors, where the reflections are blurred to various degrees due to surface roughness that scatters the rays of the reflections. === Glossy reflection === Fully glossy reflection, shows highlights from light sources, but does not show a clear reflection from objects. == Examples of reflections == === Wet floor reflections === The wet floor effect is a graphic effects technique popular in conjunction with Web 2.0 style pages, particularly in logos. The effect can be done manually or created with an auxiliary tool which can be installed to create the effect automatically. Unlike a standard computer reflection (and the Java water effect popular in first-generation web graphics), the wet floor effect involves a gradient and often a slant in the reflection, so that the mirrored image appears to be hovering over or resting on a wet floor.
Single address space operating system
In computer science, a single address space operating system (or SASOS) is an operating system that provides only one globally shared address space for all processes. In a single address space operating system, numerically identical (virtual memory) logical addresses in different processes all refer to exactly the same byte of data. In a traditional OS with private per-process address space, memory protection is based on address space boundaries ("address space isolation"). Single address-space operating systems make translation and protection orthogonal, which in no way weakens protection. The core advantage is that pointers (i.e. memory references) have global validity, meaning their meaning is independent of the process using it. This allows sharing pointer-connected data structures across processes, and making them persistent, i.e. storing them on backup store. Some processor architectures have direct support for protection independent of translation. On such architectures, a SASOS may be able to perform context switches faster than a traditional OS. Such architectures include Itanium, and Version 5 of the Arm architecture, as well as capability architectures such as CHERI. A SASOS should not be confused with a flat memory model, which provides no address translation and generally no memory protection. In contrast, a SASOS makes protection orthogonal to translation: it may be possible to name a data item (i.e. know its virtual address) while not being able to access it. SASOS projects using hardware-based protection include the following: Angel IBM i (formerly called OS/400) Iguana at NICTA, Australia Mungi at NICTA, Australia Nemesis Opal Scout Sombrero Related are OSes that provide protection through language-level type safety: Br1X Genera JX a research Java OS Phantom OS Singularity Theseus OS Torsion